The COH heat conduction films are films made of very soft silicone with an additional heat conduction function; when placed between heat sources and heat sinks, they effectively counteract air gaps between surfaces.
The films also provide excellent electrical insulation and are both flame-retardant and flexible in their adaptability.
The foils provide low rebound and pressure tension, making them perfect for the application of transferring heat generated by the IC chip to the heatsink, thereby specifically preventing PC malfunctions and device damage.
